EVG 520IS Wafer Bon

Listing description

EVG 520IS WAFER BONDER consisting of:

- Model: EVG 520IS Bonder
- Semi-automated Wafer Bonding System
- Single-chamber wafer bonder
- Configured for 8/200mm wafers
- 1 Thermal Bond Chuck included (8/200mm)
- Semi-automated operation for low-volume production applications
- Manual loading and unloading of wafers
- Symmetric rapid heating and cooling chuck design
- Independent top and bottom side heater
- High pressure bonding capability (40kN)
- Multi-stack bonding options
- Integrated cooling station for high throughput
- Max contact force: 40 kN
- Max temperature: 550°C
- Vacuum: 1E-4 mbar
- Ulvac GLD-201A vacuum pump
- Chiller
- System Computer with Windows XP OS
- Operations manual for EVG 520IS Bonder
- Manufactured in 2007!

This equipment is located in US