EVG EV501 Wafer Bon

Listing description

EVG EV501 WAFER BONDER consisting of:

- Model: EV501
- Vintage 2004
- Capable of thermo compression, fusion or anodic wafer bonding
- Bond chamber for up to 150mm wafers - configured for 2 wafers
- Thickness: Max wafer stack thickness 6mm
- Bottom side heater: 550°C max. in 1°C steps
- Temperature uniformity: ± 1,5 %
- Turbo Pump
- High voltage power supply for Anodic bonding - additional tooling maybe required
- Electronics Rack
- Computer & Software
- LCD Monitor
- Roughing Pump
- Operators Manual for EVG 501 Bonder
- Available for full inspection and demonstration
- Installation, training, service, and support available worldwide for all our refurbished EVG Bonders!

This equipment is located in US