Online Auction - Handling and Device Packaging Equipment

Auctioneer EquipNet
Closing date Sept. 18, 2019
Location USA USA
Category PCB and Semiconductor / Process and Packaging
ID PCB0166
Status Closed

Handling and Device Packaging equipment from a leading Semiconductor Manufacturer and Package Assembly Company

Featured Items:
- Denso Wave lncorporated VS-6577GM Robot arm With Controller and teaching Pend and some cables
- Orbotech SPRINT-100I Ink Barrier Printer with Simplimatic Automation Model 3516 Epson G6-553S Robot
- Thermonics T-2500IX Precision Temperature Forcing System With Three Extra Shrouds
- SP Scientific XE75 Air-Jet XE Precision Temperature Cycling System With Controller
- Universal Instruments Corp GSM Genesis Prod Tree 49714303 HSCC113 4990C GC-60 Pick and Place System
- ASM Assembly Automation BP2000 Automatic Ball Placement System
- Speedline Technogies MPM 125 Screen Printer
- Towa Corporation YPS-2060 Chip Molding System
- Universal Instruments Corporation GSMX High-Accuracy and High-Throughput Placement System
- Matrix System One E 102/105 Stripper Plasma/Descum Dry Asher Etch
- Technics Plasma TEPLA 600-AL Semi-Automatic RF Plasma ASHER System
- Process Materials PMI IBAD CHAMBER Ion Beam Assisted Deposition Chamber
- Device Test Rack

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