Online Auction - Wafer Production Equipment for Sale

Auctioneer Astoca
Closing date May 11, 2017
Location Malaysia Malaysia
Category PCB and Semiconductor
ID PCB103
Status Closed

From Astoca, this online auction is a sale of wafer slicing and lapping machines located in Penang, Malaysia.

Equipment of interest in this sale includes:

- Late model TAKATORI 8 inch and 6 inch Diamond Wire Multi Cut Saws
- KEMET and FUJIKOSHI Lapping and Polishing Machines
- Laser Markers
- Annealing furnaces
- X Ray Measurement
- And more

For more information and to register your interest click the view auction details button below.

Go to the auction page

Please note that this description may have been translated automatically.
Open auction page