KohYoung KY-8030L Solder paste inspection system Verified seller

Description

True patented 3D volume measurement
• No false calls – no escapes – no shadow problems
• Highest accuracy and repeatability
• No PCB color sensitivity
• Solder paste printing optimization - at its
Metrology Capability Volume, Area, Height, Offset, Bridging and Shape Deformity
Types of Defects Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset
Measurement Principle 3D Shadow Free Moiré
Camera Technology
Camera 2MPix
XY Pixel Resolution 20 µm
Z Resolution 0.37 µm
Inspection Performance
Inspection Speed ​​at 20 µm Shadow Free Mode 15.0 cm2/sec
High Speed ​​mode 19.7 cm2/sec
Volume Repeatability (on a KY Calibration Target) < 1% at 3 σ
Volume Repeatability (on a PCB) < 3% at 3 σ
Height Accuracy (on a KY Calibration Target) 2 µm
Gage R&R (± 50 tolerance) << 10 % at 6 σ
Max. PCB Warp Compensation ± 3.5 mm
Max. Paste Height 400 µm
Min. Paste Deposit Size at 20 µm Rectangle 150 µm
Circle 2000 µm
Min. Distance between Paste Deposit 100 µm (at 150 µm paste height)
PCB Handling
Min PCB size 50 x 50 mm
Max PCB size 510 x 510 mm
PCB thickness 0.4 ~ 5.0mm
Max PCB weight 2 kg
Bottom side clearance 25.4 mm
Conveyor Width Adjustment Automatic
Conveyor Fix Type Front/Rear Fixed (Factory Setting)
Conveyor Height 970 ~ 870mm