Specifications

-------------------
worked hours
hours under power
state good
At local norms ---------
status visible

Description

last preventive maintenance performed Dec-17-2020
Precision dicing saw for silicon wafers and thin substrates up to 200mm diameter

accepts 2"/3" hubbed or annular blades

DC brushless 60,000 rpm air bearing 1.2Kw motor

0.2u resolution

feed rate up to 350mm/s

touch down blade height sensor

Matrox vision system with auto focus and auto illumination

2x-8x zoom

2 arc-sec rotary axis repeatability

200-240v, 50/60hz

software ver. 4.3.2

operating manuals

specify 200mm or 150mm ceramic wafer chuck.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Client type Reseller
Active since 2019
Offers online 72
Last activity May 14, 2025

Description

last preventive maintenance performed Dec-17-2020
Precision dicing saw for silicon wafers and thin substrates up to 200mm diameter

accepts 2"/3" hubbed or annular blades

DC brushless 60,000 rpm air bearing 1.2Kw motor

0.2u resolution

feed rate up to 350mm/s

touch down blade height sensor

Matrox vision system with auto focus and auto illumination

2x-8x zoom

2 arc-sec rotary axis repeatability

200-240v, 50/60hz

software ver. 4.3.2

operating manuals

specify 200mm or 150mm ceramic wafer chuck.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Specifications

-------------------
worked hours
hours under power
state good
At local norms ---------
status visible

About this seller

Client type Reseller
Active since 2019
Offers online 72
Last activity May 14, 2025

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