ACE KISS 102IL Selective Solder Machine

Listing description

Demo Unit – Low Hours

Windows 7 O/S

SWAK programming interface

Standard Features:

SMEMA edge conveyor with program controlled width adjustment, positive PCB location and PCB flattening
“Super Quick” motion for fastest processing times
Windows 7 O/S with the interactive SWAK on machine programming interface (see the SWAK data sheet and video) Rapid setup and time to “first production”, usually within 10 minutes
Automated Fiducial Correction
Dual monitors (great for simultaneous video feed from cameras)
Step and repeat capability in both X and Y axis for multiple boards in a panel
Lead alloy solder pot and pump assembly included—lead free alloy (all titanium) and HMP alloy pot and pump available
Full set of 7 “Bullet Nozzles”
Heated Nitrogen to the solder nozzle
Programmable flux deposition
Programmable solder wave flow rate
Programmable Solder Pot Timer
Automated in process solder wave height check / adjust
Automated solder pot level check and fill
Two (2) process witness cameras
Precision KFS-SP atomizing flux applicator
Offline programming software
Set the time/temp profile for each individual component type for maximized process control and TAKT time
Absolute control over all critical process parameters:
Solder temperature interlocked to within 2 degrees C
Height and travel speed of the solder wave
Programmable initial pre-heat soak time
PCB Panel Size:

Minimum: 2” x 2” (50mm x 50mm)
Maximum: 16” x 16” (400mm x 400mm)
Motion:

Z-Axis Accuracy/Repeatability +/-.002″ Speed 0-3 inches/sec
X and Y Axis Accuracy/Repeatability +/-.002″ Speed 0-4 inches/sec
Solder Pot:

Temperature PID proportioning (0-400°C) ± 2°C
Solder Capacity 30 lbs. (14 kilos)
Pump PC controlled
Physical:

Dimensions 54″ wide x 57″ deep x 54″ high (1371mm wide x 1447mm deep x 1371mm high)
Weight (dry) 900 lbs. (409 kilos)

This equipment is located in US