Axic Plasmamaster 20

Listing description

With the PlasmaSTAR®’s wide selection of chamber and electrode configurations the system is ca- pable of satisfying a wide range of plasma processing conditions. These processes range from simple surface cleaning to sophisticated submicron RIE etching. Axic, Inc., in conjunction with our large customer base has developed proven process recipes guaranteeing your system is up and processing from the day you install the system. Only the highest quality sub components are used in the manufacturing of the PlasmaSTAR® system providing the highest up-time, reliability, repeatability and serviceability. Typical processes include:

? Plasma Descuming

? Photo-Resist Stripping

? Surface Treatment

? Anisotropic & Isotropic Etching

? Failure Analysis Applications

? Material Modification

? Package Cleaning

? Passivation Etching

? Polyimide Etching

? Adhesion Promotion

? Biomedical Applications

? Polymerizaton

? Hybrid Cleaning

? Pre-Bond Cleaning

DIMENSIONS

System – Width 35” x Depth 32” x Height 21”

Chamber (interior) Width 14.75” x Depth 17” x Height 12”

WEIGHT
150 lbs

This equipment is located in IE