EVG 520


Last availability: unknown - check availability

Listing description

EVG 520 WAFER BONDER consisting of:

- Model: EVG 520
- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Capable of anodic bonding
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Auto opening of bond tool cover
- Windows based control software and operation interface
- Wafer size: up to 150mm capable
- Max Bond Force: 20 kN
- Top side heater: 550°C max. in 1°C steps
- Bottom side heater: 550°C max. in 1°C steps
- Chiller
- Temperature uniformity: ± 1,5 %
- Turbo pump and controller
- Roughing pump
- Load/unload tool
- System computer, monitor, and keyboard
- Operations Manual for EVG 520 Bonder
- Available for full inspection and demonstration
- Installation, training, service and support available worldwide!


Last availability: unknown - check availability

Listing information

Manufacturer EVG
Model 520
Year -
Country USA USA
Condition Good
Main category PCB and Semiconductor
Subcategory Wafer & Semi Test Equipment
ID P90210006

Last availability: unknown - check availability

About the seller

Client type Machinery dealer
Active since 2011
Number of listings 73
Country USA USA
Last activity Oct. 14, 2019
Contact Click here