EVG 520

Listing description

EVG 520 WAFER BONDER consisting of:

- Model: EVG 520
- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Capable of anodic bonding
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Auto opening of bond tool cover
- Windows based control software and operation interface
- Wafer size: up to 150mm capable
- Max Bond Force: 20 kN
- Top side heater: 550°C max. in 1°C steps
- Bottom side heater: 550°C max. in 1°C steps
- Chiller
- Temperature uniformity: ± 1,5 %
- Turbo pump and controller
- Roughing pump
- Load/unload tool
- System computer, monitor, and keyboard
- Operations Manual for EVG 520 Bonder
- Available for full inspection and demonstration
- Installation, training, service and support available worldwide!

This equipment is located in US