EVG Gemini

Listing description

EVG GEMINI AUTOMATED PRODUCTION WAFER BONDING SYSTEM consisting of:

- Model: Gemini Production Wafer Bonder for up to 200mm wafers
- Fully-Automated Wafer Bonding System
- For high volume production applications
- 4 Universal wafer bond chambers w/ top & bottom side heaters
- Fully motorized SmartView splitfield microscope for double side viewing
- Configured for 4"/100mm & 6"/150mm wafers
- Bond Chucks for each wafer size
- Automatic alignment
- Robotic handling between cassette and alignment stage
- Robotic handling between aligner and bonder
- Send, receive and reject cassette stations
- Up to 10 kN pressure bonding capability
- Integrated cooling station for high throughput
- Max temperature: 550°C
- System Computer with Windows OS
- Wafer ID Reader
- Operations manual for EVG Gemini
- Vintage 2012

This equipment is located in US