Koh Young Ky-3030 Val 3D Solder Paste Inspection

Listing description

Description
True 3D Volume Measurement
The true volume of solder pastes on PCBs using Koh Young's authentic 3D profilometry method.
Basic Functions of KY-3030 Series
Paste defects detection including insufficient / excessive / missing paste, shape deformity, bridging and paste displacement
Highly Reliable and Accurate Inspection Systems

Volume repeatability : less than ±1% at 3σ (on a calibration target)
Volume repeatability on average: less than ±3% at 3σ (on a PCB)
Height accuracy: 2μm (on a calibration target)
GageR & R: much less than 10% at 6σ (± 50% tolerance) (for around 3,600 solder pastes on real PCBs from customer site)

No Shadow Effects and No Specular Problems
With Koh Young's proprietary technology, KY-3030 series overcome the common bottleneck of 3D measurement systems.
Fast Real-time 30 Inspection
Less than 5 sec on a real PCB with 4,000 pads(160 X 102mm)
Absolute Convenience
Less than 10 min. for inspection job file programming and conditions setup.
Special Features and Advantages

Extract Solder Paste Volume Only by Bare Board Teaching
Robust Inspection against PCB Warp up to ±5mm without any Z-axis motion
Effective Feedback Sensor to Operators
Remote Monitoring & Controlling Software
Sets of the SPC (Statistical Process Control) data for SMT Process Management

Specifications
Performances
Metrology Capability Volume, Height, XY Position, Area
Defect Detection lnsufficient / Excessive / Missing Paste, Bridging, Shape Deformity, Paste DispIacement
FOV (Field of View) Size 32 X 24 mm (1.26 x 0.94 in.)
XY Table Accuracy 10μm
Typical Load / Unload & Fiducial Find Time 4 sec
Height Accuracy 2μm
Repeatability Height: ±1% Volume: ±1%
Min. Paste Size Rectangle: 150μm (5.9 mils) Circle: 200μm (7.87 mils)
Max. Paste Height 400μm (15.7 mils)
Max. PCB Warp ±5mm (0.19 in.)
Min. Distance between Solders 100μm (3.93 mils) (in case of 150μm solder paste height)

Systems
Statistical Analysis Histogram, X Bar & R Chart, X Bar & S chart, Cp & Cpk, % Gage R&R Data,SPI Daily / Weekly / Monthly Reports
Inspection Position Teaching Supports GERBER format (274 X 274D)
Vision Algorithm 3D / SFM (Shadow Free Moire Interferometry)
OS Windows XP Professional
Probe Type No Shadow Effect
Camera 2M B/W Digital Camera (1600 X 1200)
Dimensions ( W X D X H ) / Weight 1000 X 1290 X 1440 mn ( 40 X 51 X 57 in.) / 750 Kg (1,654lbs)
Max. PCB Size VAL: 510 X 460mn(20 X 18 in.)

TYPICAL INSPECTION SPEED
Type of Sample Board Cellular Board(4 Arrays)
No. of Pads 3,848
Board Size(mm) 160 X102(6.3 X 4 in.)
High Speed Mode 5 sec
High Resolution Mode 6 sec
No Shadow Mode 8.2 sec
Type of Sample Board Notebook Board
No. of Pads 3,845
Board Size(mm) 184 X 219 (7.2 X 8.6 in.)
High Speed Mode 12.1 sec
High Resolution Mode 14.6 sec
No Shadow Mode 19.9 sec
Type of Sample Board Network Board
No. of Pads 7,006
Board Size(mm) 320 X 230 (12.6 X 9.1 in.)
High Speed Mode 25.3 sec
High Resolution Mode 30.1 sec
No Shadow Mode 41 sec

This equipment is located in US