Koh Young Zenith LiTE Advanced 3D AOI

Listing description

Description
Zenith LiTE
World- Class Full 30 Automated Optical Inspection

Full 30 AOI overcoming the shortcomings of 20 inspection

Minimizes shadow problems utilizing 4-way projection
Performs defect diagnosis and root cause removal through real-time 3D data
Fast and intuitive programming inspection conditions using parametric approach

Full 30 data- based process optimization solution: Realization of industry 4.0 I smart factory

Process information DB and real-time remote monitoring
Inspection program management automation & efficiency

Good value model for a variety of production environment

Flags and Quantifies All Defects
Missing, Offset, Rotation, Polarity, Upside Down, OCV, Solder Fillet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.
The Perfect Warp Compensation Solution
PCB warp becomes more pronounced during the reflow process in the applications using FPCB or building large boards, due to the high temperature required for reflow process. Zenith LiTE compensates serious FPCB warp in real time while not sacrificing inspection speed and without false calls. Koh Young’s KSMART Warp offers a simple and easy solution by teaching bare board prior to inspection to recognize pattern information without PCB CAD data.
Fast and Easy Programming Using 3D Measurement Values
Koh Young’s innovative programming tool offers the new concept of easy programming by using 3D measurement value. Koh Young’s own 3D Component Library, threshold values and inspection results are all based on true measurement values. Users can eliminate lengthy fine tuning process, and programming is much easier for all user levels.
Intuitive and Accurate Defect Judgement

Lifted Body(Body Coplanarity) - Judge Defect by Measured Component Height Profile
Lifted Lead(Lead Coplanarity) - Judge Defect by Measured Lead Shape Profile
Solder Joint Defects - Full 3D Inspection of Solder Joint

Requirement Solution
Full 3D Inspection of All Components 3D Shadow Free Moiré Technology & 4 Way Projection
Wide Measurement Range + Accuracy Multi Frequency Moiré Technology
Real Time PCB Warp Compensation Pad Referencing + Multi Frequency Moiré Technology
Dark Component & White Body Component Location True 3D Measurement
Legending and Specular Regions on PCB True 3D Measurement
Lifted Lead Measurement True 3D Measurement
Shallow Polarity Dimple Measurement True 3D Measurement
Specifications
XY Axis

Structure: XY Gantry
Drive: Servo motor + Ball Screw
Encoder Type: Rotary Encoder
Resolution: 1.0µm/pulse
Speed: 1.0m/sec
Acceleration: 1.0G
XY Accuracy (Include inspection accuracy): ± 20µm

Conveyor

Type: 1, 3 Rail Fixed
Direction: Left -> Right or Right -> Left
Structure: 1 stage (1 piece)
Belt Type: ESD Timing Belt
Width adjustment: Automatic
Transport Height: Max 950mm / Min 870mm

PCB Specification

Max. PCB Size: Dual Mode: 510 x 320mm / Single Mode: 510 x 580mm
Min. PCB Size: 50 x 50mm
PCB Thickness: 0.4 - 5.0mm
Max. PCB Weight: 5.0Kg
Edge Clearance (Top): 2.5mm
Edge Clearance (Bottom): 3.5mm
Clearance (Top): 50mm
Clearance (Bottom): 50mm

Control Unit

Control Method: PC Based Control (Windows)
Input Unit: Mouse & Keyboar
Monitor: 19" LCD Panel

Operation Condition

Operation Temperature: 20-30°C
Operation Humidity: 30-80% non-condensing

Safety

Certification: CE
Sound Noise: Lower than 65dB

This equipment is located in US