Mvp Autoinspector Supra E Aoi

Listing description

TheSupra E is the leading AOI solution for SMT manufacturers. The system provides ease-of-use, superior defect coverage and cost effectiveness in a single package. MVP's Quad-Color technology provides the ability to use multiple angles of light to determine solder defects from a single image without the need for other techniques.
Configured with a 5, 8, 12 or 24 MP camera, telecentric lens and our Linear Motion Drives, the Supra E provides fastest inspection times while increasing inspection capabilities. The Supra E provides the highest reliability through the use of our linear motion technologies, thus removing the mechanical stresses of start/stop motion systems. Combined with our leading worldwide support organization, the Supra E provides world-class, efficient, cost effective, defect coverage.

Flexible, Reliable and Robust AOI

Post Reflow, Post Paste and Post Wave

High Resolution Telecentric optics

5, 8, 12 or 24 Megapixel Color Camera

Optional 3D Inspection

Highest Resolutions and Metrology

Easy-To-Use Performance Based Programming

01005 Solder Joint Inspection, Certified

Specifications
Inspection Speed

Acquisition speed of > 75 megapixels per second with a single camera

Up to 65 sq.cm per second (10sq.inches per second) inspection dependant on board layout, density and field of view

System Hardware

State-of-the-art 5, 8, 12 or 24 MP large format color cameras

3D Option with 1 um repeatability

Programmable variable LED strobe lighting

Proprietary multi-color illumination

Standard resolutions available from 3 to 10µ

0201, 01005, 008004 capable

Copy-exact, inter-machine capability

Precision X/Y stage with 0.5 micron ball-screw/rotary brushless DC motor drive system

Dual closed loop linear encoders

System Software

CAD-driven, library-based programming software

Proven high performance, adaptable algorithms with highest detectability and lowest PPM false accept and false reject rates

Full network integration (TCP/IP, NFS Protocol)

Off-line or in-line defect review capability

Defect image archive capability

Real-time SPC package

Report generation utilities for production inspection measurements

Inspection program change tracking

5th generation, proven inspection software

Multipass technology, adjustable lighting intensity

MVP Dynamic Process Control compatible software

Material Handling

SMEMA Interface

Flexible PLC control

Auto board clamp for accurate registration

Support for thin and standard PCB processing

Physical Specification

Inspection envelope 508mm x 508 mm (20" x 20") Lower with 3D module.

Footprint 990mm W x 1100mm D

Height 1580mm (62")

Conveyor length 996mm

Power 208-240VAC 50/60Hz, 10A

Air 60 PSI, 1 CFM

Weight 500 kgs (1100 lbs)

System Configurations

MVP Supra E Quad-Color proprietary multi-color illumination

Options

3D quad projector system for SMT, SPI, die, packaging & height measurements

Off-line programming capability

Dual-lane material handling

CAD and Gerber translation software

Dotplate and lighting calibration tool

Programmable Z-Axis control function

MVP DPC - Dynamic Process Control

This equipment is located in US