QMC - DPS-600 Price drop

Listing description

Manufacturer: QMC Model: DPS-600 Type: LED Die Probing System Version: Up to 6 inch Condition: excellent Vintage: Dec 2011 Sale condition: as is where is Quantity: 1 Comments: -Still installed in the fab. -Shut down and powered off. -It can be inspected by appointment. -The equipment is in excellent condition, with no missing parts. -The equipment was lightly used in an R and D environment for around 2-3 years. -The equipment ran 4 inch Sapphire wafers -For the detailed configuration please refer to the attached photos and PDFs. -Further information from the system manuals is available on specific request.QMC DPS-600- System Specification1. High-speed performance and stability for mass production· Easy & quick exchange of wafer / BIN ring· Quick and quick exchange of blue tape· Easy to check & exchange collect and eject with vision system· Easy to replace probe card2. Fully automatic operation system· Automatic Loading / Unloading wafer from Wafer / BIN cassette· Full automatic wafer alignment· Automatic level teaching of collect and eject pin3. High accuracy· Increase the accuracy of optical power measurement with 3.3 Inch integrating sphere· High sorting accuracy4. Measurement· Electrical characteristic measurement: IF, VF, IR, VR· Optical characteristic measurement: Power, Luminous intensity, Spectrum5. Special illumination machine vision system for PSS or RS wafer6. Advanced chip defect inspection with machine vision system Items Specification Type of LED Lateral type LED only Wafer Size Up to 6 Inch Chip Size 300umX300um ~ 1,500umX1500um Typical Cycle Time 0.21sec/chip (7 measurement items) Wafer cassette slot 10ea BIN cassette Slot 64BIN Sorting Accuracy (X, Y-axis) +/- 30um Sorting Accuracy (Theta axis) +/- 3° System Dimension 1350 X 1250 X 1800 mm (excluding tower lamp) System weight 800kg approx

This equipment is located in KR