SPEA FP 4040 HI-LINE SERIES 5 Flying Probe Tester (2004)

Listing description

SPEA 4040 Flying Probe with Boundry Scan

Model: FP 4040 HI-LINE SERIES 5 Flying Probe Tester
Year: 2004

4040 Hi Line; high speed high accuracy
(1) DRIV-10 V/I Generator; Precision Driver, 4Q, +/-10V, +/- 1A
(1) Boost-80 V/I Generator; Precision Driver, 4Q, +/-80V, +/- 1A
(1) PWSR-10F 5 slot chassis for programmable power supply for flying probe tester (Qty 1)
(2) PWS-60 Programmable V/I power supply from 0 to 20V, 5A
(2) PWS-70 Programmable V/I power supply from 0 to 30V, 3A
(1) Camera-20 Camera on axis 4 for visual field extensions
(1) SBL100 Shuttle board loader for 4040 Hi-Line series
- Lock-100 Board locking system with PCB height compensator
(1) SBL-ZIF—1024 Interface for SBL predisposed for 1040 TP
(1) EscanFly-20 Electro Scan on two moving heads, captors on heads 2/3
(1) EscanFly-30 Electro Scan on bottom fixed, captors, (H/W + S/W); 16ch multiplexer
test area 50x400mm top side
Internal graphic printer; 24 lines / sec
Voltage: 3 Phase, 208V
Frequency: 50/60 Hz
Power: 6 kVA
Pressure: 0.7 Mpa
Footprint: 1755 x 1240 mm
Height: 1550 mm
Weight: 1160 Kg
board conveyor height: 850mm (SMEMA)

Boundry scan option installed and included
- Technology for signal access without nails and probes
- Automated test generation and pin-failure diagnosis
- Debug of BGA pins and embedded nets
- In-system programming of Flash and PLDs
- Tool suite completely integrated in SYSTEM CASCON™

Boundary Scan (IEEE Std. 1149.x) is a revolutionary technology substituting the
physical access via nails and probes by means of special on-chip electronics (electronic
nails) in conjunction with a dedicated four-wire bus. The method was developed as
successor of the digital In-Circuit Test (ICT). It implements the tester’s pin electronics
directly in the IC design. Boundary Scan provides a multitude of opportunities for
structural or functional tests and hardware debug as well as in-system programming.
Utilizing the integrated software platform SYSTEM CASCON™, users can implement
the full potential of all strategies comprehensively and very flexibly throughout entire
product life cycle.

This equipment is located in US