SPTS Multiplex PECVD System

Listing description

STS MULTIPLEX PECVD SYSTEM consisting of:

- Model: Multiplex PECVD
- Plasma Enhanced Chemical Vapor Deposition (PECVD) System
- Standard PECVD configuration
- Manually Loaded Vacuum Load-Lock
- Automatic Transfer of Substrate between the Load-Lock and the Process Chamber
- Loader may be specified for substrates up to 200mm in diameter (or batches of smaller substrates)
- Chuck: 100mm diameter (can be upgraded up to 200mm)
- Load Lock: MK4 single wafer load lock
- System has calrez seals (not viton)
- Dual Frequency (high and low frequency PECVD)
- RF generator 1: ENI ACG-6
- RF Generator 2: RFPP 500W (380 khz)
- Can run in Triode mode: platen can be RF driven with low frequency power supply
- Remote Gas box (see process gases below)
- System computer, monitor, keyboard
- Operating system: Windows 2000
- Affinity Chiller
- Edwards IH600 vacuum pump (chamber)
- Varian SH-100 vacuum pump (load lock)
- Operations Manuals, Electrical Drawings, Auxiliary Equipment Manuals and Software
- Configured to deposit Silicon Dioxide (SiO2), Silicon Nitride (Si3N4), and Silicon Carbide (SiC).

Gas Box Configuration (Process Gases):
- N2O, 5000sccm
- N2, 5000 sccm
- He, 1000 sccm
- Ar, 1000 sccm
- C4F8, 1000 sccm
- O2, 500 sccm
- CH4 (methane), 500 sccm
- SiH4 (silane), 100 sccm
- NH3 (ammonia), 500 sccm
- 2 purge lines (for Silane and NH3)

- Manufactured: April, 2005!
- Used minimally and in like-new condition!

This equipment is located in US