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SSEC CLEAN 3300
MODEL: M3302
208 VAC, 3PH, 60Hz, 30 AMP
Date of Mfg. 8/30/05
AC Dwg No. 330i1712
1) the wafer is soaked in the mix of solvents (so-called cleaning by submersion)
2) there is processing by spray solvents ( so-called Fan Spray Processing) and nitrogen drying stage.
The unit has so-called dry-in/dry-out system (dry wafers in/ dry wafers out).
Post DRIE etch TSV cleaning is essential to the reliability of 2.5D and 3D IC devices. SSEC’s proprietary
soak and spray technology minimizes spray time and chemistry use for lower cost-of-ownership than
conventional wet bench or single spray approaches; it achieved 100% photoresist and sidewall
fluoropolymer removal 5x faster than spray only.
The tool features equal-time soak software for process control. Each wafer soaks in heated, recirculating
solvent long enough to penetrate the polymer residue. Following wet transfer to the spray station, the
wafer is subject to a high-pressure spray to rapidly remove remaining residue. The result is 100%
photoresist and polymer removal. Soak and spray takes 88% less time and 77.5% less chemistry than
spray-only processes.
This equipment is located in US
Manufacturer | Ssec |
Model | M3302 |
Year | - |
Country | USA |
Condition | Good |
Main category | PCB and SMT equipment |
Subcategory | Auto Insertion Machine |
ID | P11028002 |
Client type | Machinery dealer |
On Kitmondo since | 2017 |
Number of listings | 50 |
Country | USA |
Employees | 11 - 50 |
Established | 1989 |
Last activity | May 30, 2023 |
Contact | Click here |