STS ASE Multiplex (Advanced Silicon Etcher). Bosch Process

Listing description

• OEM = Surface Technology Systems Limited (AKA: STS)
• Model = MESC Multiplex ICP ASE
• Type = ICP RIE (Inductively Coupled Plasma, Reactive Ion Etch)
• Description of Process = ASE (Advanced Silicon Etch, Bosch Process)
• Serial = 31143
• Wafer Size = 150mm
o Loader capacity = 2 wafer Carousel
• Chuck Type = Mechanical Weighted Clamp
• Process Gases:
o C4F8 = 300 SCCMS
o SF6 = 600 SCCMS
o O2 = 100 SCCMS
o AR = 100 SCCMS
o MFC’s are Millipore FC2901 Series
• Turbo Pump = Leybold Mag 2000 CT
• RF Generator 1 = ENI ACG-3
• RF Generator 2 = AE RFG 3001 (Advanced Energy)
• Vacuum measurement = MKS Instruments
• Gate Valve = VAT throttling type gate valve
• Slit Valve = VAT Slit Valve
• Manuals = STS MESC Multiplex ICP Operator’s and Modular Parts Catalogue
• Vacuum Pump Loadlock = Edwards Pump E2M40
• Vacuum Pump Process Module = Edwards Pump IQDP80 w/IQMB250 Blower (Intelligent Quiet Interface)
• Chiller = Affinity, PWG-060K-BE33CBC2
• Support Module = STS Controller Cabinet / AC Breaker Panel

This equipment is located in US