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• OEM = Surface Technology Systems Limited (AKA: STS)
• Model = MESC Multiplex ICP ASE
• Type = ICP RIE (Inductively Coupled Plasma, Reactive Ion Etch)
• Description of Process = ASE (Advanced Silicon Etch, Bosch Process)
• Serial = 31143
• Wafer Size = 150mm
o Loader capacity = 2 wafer Carousel
• Chuck Type = Mechanical Weighted Clamp
• Process Gases:
o C4F8 = 300 SCCMS
o SF6 = 600 SCCMS
o O2 = 100 SCCMS
o AR = 100 SCCMS
o MFC’s are Millipore FC2901 Series
• Turbo Pump = Leybold Mag 2000 CT
• RF Generator 1 = ENI ACG-3
• RF Generator 2 = AE RFG 3001 (Advanced Energy)
• Vacuum measurement = MKS Instruments
• Gate Valve = VAT throttling type gate valve
• Slit Valve = VAT Slit Valve
• Manuals = STS MESC Multiplex ICP Operator’s and Modular Parts Catalogue
• Vacuum Pump Loadlock = Edwards Pump E2M40
• Vacuum Pump Process Module = Edwards Pump IQDP80 w/IQMB250 Blower (Intelligent Quiet Interface)
• Chiller = Affinity, PWG-060K-BE33CBC2
• Support Module = STS Controller Cabinet / AC Breaker Panel
This equipment is located in US
Manufacturer | Surface Technology Systems (Sts) |
Model | Advanced Silicon Etcher (ASE). Multiplex Bosch Process |
Year | 2001 |
Country | USA |
Condition | Excellent |
Main category | PCB and SMT equipment |
Subcategory | Semiconductor Equipment |
ID | P20708003 |
Client type | Machinery dealer |
On Kitmondo since | 2009 |
Number of listings | 10 |
Country | USA |
Employees | 1 - 10 |
Established | 2007 |
Company description |
Since 2007 our company has been a recognized leader in providing world-wide sales, service and advanced technical assistance in support of automated systems utilized in the fabrication and produ… read more Since 2007 our company has been a recognized leader in providing world-wide sales, service and advanced technical assistance in support of automated systems utilized in the fabrication and production of multiple manufacturing processes. |
Last activity | July 27, 2023 |
Contact | Click here |