Used Disco DFD 2D/8

Listing description

Equipment : Fully Automatic Dicing Saw

Location : In Factory

Application : Dicing/Cutting/Slotting various wafers

Workpiece size 200 x 200 (mm)

X-axis

Useable stroke 218 (mm)
Cut speed 0.13 ~ 300 (mm/s)

Y-axis

Useable stroke 210 (mm)
Indexing step 0.0002 (mm)
Position accuracy (cumulative pitch) less than 0.005/160 (mm)
Position accuracy (single pitch) less than 0.003/5 (mm)
Scale resolution - (mm)

y-axis

Useable stroke 11 (mm)
Indexing step 0.0002 (mm)
Position accuracy (cumulative pitch) less than 0.005/160 (mm)
Position accuracy (single pitch) less than 0.003/5 (mm)

Z1/2-axis

Maximum cutting stroke 21.5 (for ø2"blade) * (mm)
Minimum step 0.0001 (mm)
Repeating accuracy 0.001 (mm)
Maximum blade size 76.2 (mm)

SP-axis
Max revolution 3000 (min-1[rpm])

Θ-axis
Rotation angle (max.) 380 (deg)

Spindle
Output 1.5 (kW)
Maximum revolution 40,000 (min-1[rpm])

Applicable Tape Frame MAX 2-6-1 　

Utilities
Power supply 3Phase 200V 　
50-60Hz 　

Power consumption

When processing 1.5 (kW)
During warm-up 1 (kW)
Maximum power 3.5 (kVA)
Air pressure(Not including Airgun) 0.5~0.6[5.0~6.0] (MPa[kgf/cm2])
Air flow rate(Not including Airgun) 162 (L/min(ANR))
Water pressure 0.3[3.0] (MPa[kgf/cm2])

Water flow rate

Cutting water 0.4~6.0 (L/min)
Cleaning water 2.5 (L/min)
Duct required suction 1.5 (m3/min)
Apperance Machine size 1,600W x 1,500D x 2000H (mm)
Machine weight 950 (kg)

*: ø2" = 55.56mm is assumed. A reference value only.

This equipment is located in KR