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Equipment : Fully Automatic Dicing Saw
Location : In Factory
Application : Dicing/Cutting/Slotting various wafers
Description :
Maximum wok size
ø 203.2
Compatible frames
2-6, 2-8
X Axis
Cutting range (mm)
210
Feed rate input range (mm/s)
0.1 - 450
Y-axis
Cutting range (mm)
210
Index step (mm)
0.0001
Positioning accuracy (mm)
0.003 in/210
(single error) within 0.002/5
Scale resolution (mm)
0.0002
Effective stroke (mm)
26
Positioning accuracy (mm)
Within 0.002/26
Scale resolution (mm)
0.0002
Z1-Z2 axis
Effective stroke (mm)
7.2 (for ø 2" blades)
Movement resolution (mm)
0.00025
Repeatability (mm)
0.001
Maximum blade diameter (mm)
ø 55.56
ø 76.2
θ axis
Max. rotation angle (deg)
380
Spindle
Rated power (kW)
1.0 at 60,000 min-1
Rated torque (N・m)
0.16
Speed range (min-1)
6,000 - 60,000
Machine dimensions (WxDxH) (mm)
1,350 x 1,168 x 1,235
Machine weight (kg)
Approx. 1,300
This equipment is located in KR
Manufacturer | Disco |
Model | DFD 651 |
Year | - |
Country | South Korea |
Condition | Excellent |
Main category | PCB and SMT equipment |
Subcategory | Semiconductor Equipment |
ID | P30411010 |
Client type | Machinery dealer |
On Kitmondo since | 2013 |
Number of listings | 0 |
Country | South Korea |
Last activity | April 13, 2023 |