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Equipment : Fully Automatic Dicing Saw
Location : In Factory
Application : Dicing/Cutting/Slotting various wafers
Description :
Models
6"-compatible automatic dicing saw
Max. Workpiece Size
ø 203.2
Applicable tape frame
2-6, 2-8
X-axis
Cutting range (mm) : 210
Max cutting speed (mm/s) : 0.1 - 450
Y-axis
Cutting range (mm) : 210
Index step (mm) : 0.0001
Single error (mm) : 0.002 or less/5
Positioning accuracy (mm) : 0.003 or less/210
Scale resolution (mm) : 0.0002
Z-axis
Maximum stroke (mm) : 7.2 (for ø 2" blade)
Moving resolution (mm) : 0.00025
Repeating accuracy (mm) : 0.001
Maximum blade size (mm) : ø 55.56
θ-axis
Maximum rotating angle (deg.) : 380
Spindle
Output (kW) : 1.0 at 60,000 min-1
Rated torque (N・m) : 0.16
Revolution speed range (min-1) : 6,000 - 60,000
Machine dimensions
(W x D x H) (mm)
1,185 x 1,168 x 1,235
1,350 x 1,168 x 1,235
Machine weight (kg) :
Approx. 1,000 - 1,300
This equipment is located in KR
Manufacturer | Disco |
Model | DFD641 |
Year | - |
Country | South Korea |
Condition | Good |
Main category | PCB and SMT equipment |
Subcategory | Semiconductor Equipment |
ID | P304110016 |
Client type | Machinery dealer |
On Kitmondo since | 2013 |
Number of listings | 0 |
Country | South Korea |
Last activity | April 13, 2023 |