Used Finetech FINEPLACER -96 "LAMBDA" BASE MODULE

Listing description

The table top flip chip bonder FINEPLACER® lambda builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.

The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges.

Due to the table top flip chip bonder’s ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range.

Features:-
-Sub-micron placement accuracy
-Superior optical resolution
-Excellent price performance ratio
-Fully manual or semi-automatic machine versions
-Individual configurations with process modules
-Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
-Data/media logging and reporting function
-Wide range of controlled bonding forces
-Full process access & easy visual programming with touch screen interface
-Various bonding technologies in one recipe
-Process module compatibility across Finetech platforms
-In-situ process observation in HD
-Modular machine platform allows in-field retrofitting during entire service life
-Synchronized control of all process related parameters
-Overlay vision alignment system (VAS) with fixed beam splitter
-Sequence control with predefined parameters

This equipment is located in MY