Used Finetech FINEPLACER -96 "LAMBDA" BASE MODULE Star Price drop

Listing description

Status: Dismantled & packed with bubble wrap
Working conditions: As per video before dismantle

History:
R&D High Precision Die Attach process
Machine is kept in a semi-cleanroom with ESD flooring
The machine was bought in late Dec 2011 and has been upgraded during early 2012. It has for approximately less than 4380 hours because it many handling small batch of R&D sample.

Fineplacer-96
Add On Option:-
1. Flip Chip Module
2.Epoxy Dispenser Module
3. Pick & Place Module
4. UV Curing System
5. Heat Plate
6. Wafer Ring Holder,
7. Accessories, and
8. Isolated Table

We provide free forklift loading to truck service.
All the accessories and Anti-Vibration Isolated Table is given free as part of the purchase

The table top flip chip bonder FINEPLACER® lambda builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.

The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges.

Due to the table top flip chip bonder’s ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range.

Features:-
-Sub-micron placement accuracy
-Superior optical resolution
-Excellent price performance ratio
-Fully manual or semi-automatic machine versions
-Individual configurations with process modules
-Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
-Data/media logging and reporting function
-Wide range of controlled bonding forces
-Full process access & easy visual programming with touch screen interface
-Various bonding technologies in one recipe
-Process module compatibility across Finetech platforms
-In-situ process observation in HD
-Modular machine platform allows in-field retrofitting during entire service life
-Synchronized control of all process related parameters
-Overlay vision alignment system (VAS) with fixed beam splitter
-Sequence control with predefined parameters

This equipment is located in MY