USED SPRINT-T 01 HIGH SPEED AUTOMATIC WIRE BONDER Price drop

Price on request
Last availability: April 9, 2024

Listing description

Highly productive and always aiming for zero defects: the fully automatic, compact wire bonder SPRINT-T 01 was adapted to the special requirements of mass production of power semiconductors and power modules in the automotive industry.

This equipment is located in MY


Please note that this description may have been translated automatically.
Price on request
Last availability: April 9, 2024

Listing information

Manufacturer Sprint
Model SPRINT-T 01 HIGH SPEED AUTOMATIC WIRE BONDER
Year 2012
Country Malaysia Malaysia
Condition Good
Main category PCB and SMT equipment
Subcategory Wire Bonder
ID P21010019
Price on request
Last availability: April 9, 2024

About the seller

Client type End User
On Kitmondo since 2022
Number of listings 29
Country Malaysia Malaysia
Last activity April 24, 2024
Contact Click here

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