Vi Technology 3D SPI Solder Paste Inspection System

Listing description

Maximum board dimensions 510 [20] x 460 [18]

Board thickness (minimum to maximum) 0.4 to 5 mm [0.01 to 0.19]

Clearance under camera 25 [0.98]

Clearance under board 25 [0.98]

Clamping system edge 3 [0.12]

PCB warpage Maximum ± 3.5 [0.13]

System accuracy and repeatability (measurement at 21°C ±- 1°C)

Measurement repeatability (3 s)

Height: < 1.5 µm at standard certification target

Volume: < 2 % at standard certification target

Measurement accuracy Height: < 3 µm at standard certification target

Measurement resolution Height: 0.1 µm

Area: 20 µm

% Gage R&R < 10%

Average inspection speed

Inspection speed 20 cm2/sec (without shadow effect)

Inspection items

Inspection items Height, volume, shape, area, bridge, position

Measurable object size Length: 160 ~ 30 000 µm

Height: 50 ~ 500 µm

Machine Dimensions (W x D x H): 1000 x 1250 x 1490 mm (40″ x 50″ x 59″)

Weight: 1080 kg

Power: AC 220 V , 22 A , 50/60 Hz

This equipment is located in US