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Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602

SSEC 3302 Resist Removal and Wafer Cleaning Machine

Price on request

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manufacturer Ssec
model M3302
year
location USA US
category Semiconductor - Wafer equipment
product id P240304602
language
bg SSEC 3302 Машина за отстраняване на съпротивление и почистване на пластини
cs SSEC 3302 Stroj na odstraňování rezistů a čištění destiček
da SSEC 3302 maskine til fjernelse af resist og rengøring af wafere
de SSEC 3302 Resistentfernungs- und Waferreinigungsmaschine
el SSEC 3302 Μηχανή αφαίρεσης αντιστάσεων και καθαρισμού πλακιδίων
en SSEC 3302 Resist Removal and Wafer Cleaning Machine
es SSEC 3302 Máquina de eliminación de resistivos y limpieza de obleas
fr SSEC 3302 Machine à enlever les résistances et à nettoyer les plaquettes
hr SSEC 3302 Stroj za uklanjanje i čišćenje pločica
hu SSEC 3302 reziszt eltávolító és ostyatisztító gép
it SSEC 3302 Macchina per la rimozione delle resistenze e la pulizia dei wafer
lt SSEC 3302 Atsparumo pašalinimo ir plokštelių valymo mašina
nl SSEC 3302 Resistverwijderings- en waferreinigingsmachine
pl SSEC 3302 Maszyna do usuwania rezystancji i czyszczenia wafli
pt SSEC 3302 Máquina de remoção de resistência e limpeza de bolachas
ro SSEC 3302 Mașină de îndepărtare a rezistenței și de curățare a plăcilor
ru SSEC 3302 Машина для удаления резиста и очистки пластин
sr SSEC 3302 Mašina za uklanjanje otpornika i čišćenje pločica
sv SSEC 3302 Maskin för borttagning av resist och rengöring av wafers
tr SSEC 3302 Direnç Sökme ve Gofret Temizleme Makinesi

Specifications

-------------------
worked hours
hours under power
state good
At local norms ---------
status visible

Description

Offer Title: SSEC 3302 Resist Removal and Wafer Cleaning Machine

Manufacturer: Ssec
Model: M3302
Technical Condition: Good
Date of Manufacture: August 30, 2005

Power Specifications:
- Voltage: 208 VAC
- Phase: 3PH
- Frequency: 60Hz
- Current: 30 AMP

Key Features:
1. Cleaning by submersion: The wafer is soaked in a mix of solvents for effective cleaning.
2. Fan Spray Processing: Processing includes spray solvents followed by a nitrogen drying stage.
3. Dry-in/Dry-out System: Designed for efficient handling of dry wafers in and out of the system.
4. Proprietary Soak and Spray Technology: Minimizes spray time and chemistry use, resulting in lower cost-of-ownership compared to conventional methods.
5. Enhanced Efficiency: Achieves 100% photoresist and sidewall fluoropolymer removal 5 times faster than spray-only methods.
6. Equal-time Soak Software: Provides precise process control by ensuring each wafer soaks in heated, recirculating solvent adequately.
7. High-pressure Spray: Rapidly removes remaining residue after soaking, ensuring complete cleaning.
8. Significant Time and Chemistry Savings: Soak and spray process takes 88% less time and 77.5% less chemistry than traditional spray-only processes.

This machine is ideal for post DRIE etch TSV cleaning, essential for the reliability of 2.5D and 3D IC devices.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Client type Reseller
Active since 2014
Offers online 24
Last activity May 14, 2025

Description

Offer Title: SSEC 3302 Resist Removal and Wafer Cleaning Machine

Manufacturer: Ssec
Model: M3302
Technical Condition: Good
Date of Manufacture: August 30, 2005

Power Specifications:
- Voltage: 208 VAC
- Phase: 3PH
- Frequency: 60Hz
- Current: 30 AMP

Key Features:
1. Cleaning by submersion: The wafer is soaked in a mix of solvents for effective cleaning.
2. Fan Spray Processing: Processing includes spray solvents followed by a nitrogen drying stage.
3. Dry-in/Dry-out System: Designed for efficient handling of dry wafers in and out of the system.
4. Proprietary Soak and Spray Technology: Minimizes spray time and chemistry use, resulting in lower cost-of-ownership compared to conventional methods.
5. Enhanced Efficiency: Achieves 100% photoresist and sidewall fluoropolymer removal 5 times faster than spray-only methods.
6. Equal-time Soak Software: Provides precise process control by ensuring each wafer soaks in heated, recirculating solvent adequately.
7. High-pressure Spray: Rapidly removes remaining residue after soaking, ensuring complete cleaning.
8. Significant Time and Chemistry Savings: Soak and spray process takes 88% less time and 77.5% less chemistry than traditional spray-only processes.

This machine is ideal for post DRIE etch TSV cleaning, essential for the reliability of 2.5D and 3D IC devices.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase

Specifications

-------------------
worked hours
hours under power
state good
At local norms ---------
status visible

About this seller

Client type Reseller
Active since 2014
Offers online 24
Last activity May 14, 2025

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SSEC 3302 Resist Removal and Wafer Cleaning Machine