Description
Manufacturer: Vi TECHNOLOGY
Model: 3D SPI
Type: SOLDER PASTE INSPECTION
Year: 04/2008
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Vi Technology 3D SPI In-line Solder Paste Inspection System
Model: 3D XPI 4000L
Vintage: 04/2008
Voltage 220
FAHP (Flying Absolute Height Profilometry) Measurement method
Dual Light Source and On-the-fly Image scan
High power M/H light 3D Sensor
Shadow free inspection based
High-speed linear motors with closed loop high resolution linear encoders
Automatic conveyor width adjustment for boards up to 510 mm x 460 mm [20" x 18"]
Height Accuracy on certification plate: < 3 μm
Height Repeatability on certification plate: <1.5 μm at 3 Sigma
Volume Repeatability on certification plate: <2% at 3 Sigma
Gage R&R: <10%
Inspection time: 20 cm²/s (without shadow effect)
Operating System: Windows XP Professional
Monitor: 17" LCD
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