SSEC 3302 Resist Removal and Wafer Cleaning Machine

Listing description

SSEC CLEAN 3300

MODEL: M3302

208 VAC, 3PH, 60Hz, 30 AMP

Date of Mfg. 8/30/05

AC Dwg No. 330i1712

1) the wafer is soaked in the mix of solvents (so-called cleaning by submersion)

2) there is processing by spray solvents ( so-called Fan Spray Processing) and nitrogen drying stage.

The unit has so-called dry-in/dry-out system (dry wafers in/ dry wafers out).

Post DRIE etch TSV cleaning is essential to the reliability of 2.5D and 3D IC devices. SSEC’s proprietary

soak and spray technology minimizes spray time and chemistry use for lower cost-of-ownership than

conventional wet bench or single spray approaches; it achieved 100% photoresist and sidewall

fluoropolymer removal 5x faster than spray only.

The tool features equal-time soak software for process control. Each wafer soaks in heated, recirculating

solvent long enough to penetrate the polymer residue. Following wet transfer to the spray station, the

wafer is subject to a high-pressure spray to rapidly remove remaining residue. The result is 100%

photoresist and polymer removal. Soak and spray takes 88% less time and 77.5% less chemistry than

spray-only processes.

This equipment is located in US