Tresky 3002/3102 Manual Die Bonder

Listing description

8" wafer, Ejector, Partial Heated Stage

The Tresky 3002/3102 Die Bonder is a highly advanced and flexible die bonding platform. It is equipped with Tresky’s unique die ejector system for pick-up from wafer, making it especially suitable for all kinds of Si, GaAs, and InP dies down to 30μm thickness12.
The system incorporates True Vertical Technology™, which guarantees parallelism between chip and substrate at any bond height12. This, along with superior ergonomics and a new PC software, makes the platform easy to operate12.
The Tresky 3002/3102 Die Bonder has a programmable Z-Drive with high accuracy and bonding force control12. The Z-movement is 95mm with 360° tool rotation12. The standard bond force range is 20g - 400g, with other force ranges available12. The placement accuracy is ±10μm, with an optional ±1μm depending on the process12.
The system supports a wide range of applications, including Die Attach, Die Sorting, Flip-Chip, 3D Packaging, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic, RFID, Sensor Assembly, Adhesive Bonding, and Eutectic Bonding12.
The Tresky 3002/3102 Die Bonder is a versatile and sophisticated system, designed for precision and ease of use in various industries

This equipment is located in CH