Semiconductor Assembly, Testing and Packing Equipment Auction

This auction from Maynards includes semiconductor assembly assets plus a range of testing and packaging equipment.

Some equipment in this auction includes:

- Advantest Tester System
- Die Bonders
- Wire Bonders
- Plating Lines
- Laser Saws
- FICO Moulding System
- Lasers
- And Much More

Viewing of this auction equipment is available only with a prior appointment.

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Please note that this description may have been translated automatically.

Online Auction - Semiconductor Assembly, Testing and Packing Equipment Auction