Agilent 5DX Series 5000

Listing description

Description
Industry-Leading Defect Coverage for Higher Yields and Lower Repair Costs

The Agilent Medalist 5DX Series 5000 offers 3D X-ray inspection capability enabling inspection of both sides of a double-sided panel in one pass
Designed for in-line or off-line automated process testing of solder connections on printed circuit board (PCB) assemblies, with pass-thru or pass-back loading
Designed with ease-of-use in mind, time to production is typically under a day for an experienced user for programming an entire panel
Digital cross-sectional X-ray images of solder joints are automatically generated and analyzed, including average solder thickness, solder thickness distributions, pin/pad/fillet positional relationships, and other solder features that are related to the quality of the solder

Algorithm Capability

Component types supported
Ball grid array (BGA) – non-collapsible
and collapsible
Column grid array (CGA)
Capacitor – chip and polarized
Chip scale package (CSP)
Surface mount technology (SMT) connector
Direct fi eld effect transistor (FET)
Flip chip
Leadless chip carrier (LCC)
Metal electrical face (MELF)
Plated throughhole (PTH)
Pressfi t Connector
Quad-fl atpack no lead (QFN)
Chip resistor
Surface mount technology (SMT) socket
Small outline transistor (SOT)

Defects detected

Shorts
Misalignment
Missing component
Non-wetting
Billboards
Solderball
Void (BGA, paste)
Opens
Insuffi cient solder
Lifted leads
Tombstones
Reversed tantalum capacitor
Excess solder

http://en.wikipedia.org/wiki/5DX
Specifications
Agilent 5DX Series 5000 Model Specifications - Model 5300
Performance specifications
Total test speed 80 to 140 joints/second (approximately 1.0 in2/sec)
Image acquisition time Up to 5 images per second
Alignment time 3 to 8 seconds (depending on panel size)
Load/unload time 12 seconds per panel for pass-through mode, 15 seconds for pass-back mode
Surface map time (points/second) Up to 5 points/sec (typical map density is 1 point/645 to 2,580 sq mm (1 to 4 sq in))
False call rate Typical false call rate of 500 to 1000 ppm
Minimum feature detection capability
Joint pitch 0.3 mm & up (0.012 in & up)
Short width (at 5 mm (0.2 in) FOV) 0.045 mm (0.0018 in)
Solder height 0.0127 mm (0.0005 in)
Test development environment
Test Link Microsoft Windows-based graphical user interface to input and translate panel layout data into machine-readable format
CAMCAD Professional Optional software available to translate CAD data to Agilent’s format
Agilent support application programming (ASAP) Standardized best-practice procedures for test development
Package library Central management of all test parameters across all panel types
Test development workstation Offline test development
Test development time (typical) Less than 30 minutes to translate and verify CAD data (using CAMCAD Professional), 4 hours to 3 days to set up panel program
Panel & specifications
Panel handling size (width x length)
Maximum 457 x 609 mm (18.0 x 24.0 in)
Minimum 102 x 127 mm (4.0 x 5.0 in)
Aspect ratio length ≥ 0.5 x panel width
Maximum inspection area 445 x 597 mm (17.5 x 23.5 in)
Panel thickness
Maximum 3.2 mm (0.125 in)
Minimum 0.5 mm (0.020 in)
Clearance
Top clearance 9.4 to 25.0 mm (0.37 to 1.0 in)
Bottom clearance 30 mm (1.2 in)
Panel edge clearance 3 mm (0.118 in) on parallel edges of the panel
Panel width tolerance ± 0.7 mm (0.0275 in)
Panel weight (including optional panel carrier)
Maximum 4.5 kg (10 lb)
Minimum 0.03 kg (0.066 lb)
Maximum acceptable panel temperatures (at time of load) 40 ºC (104 ºF)
Panel warp (after reflow and wave soldering) Warp of less than 1% of any linear dimension (0.01 in/in or 0.01 mm/mm), maximum panel warp cannot exceed 2 mm (0.08 in) (5)
Use of panel carriers Allowed – Specific carrier design required to ensure no panel bounce or shift during inspection
Line integration specifications
Board flow Flow-through with automatic adjustable rail width; Passback mode supported; Manual width adjustment
Transport heights Transport height levels between 881 mm (34.7 in) to 922 mm (36.3 in); Transport heights adjustable 19 mm (0.75 in)
Standards compatibility SMEMA
Hardware system & installation specifications
System footprint 3 x 4 m (10 x 13 ft) including electronics cabinet and monitor cart
Total system weight
Maximum cabinet weight 3400 kg (7500 lb)
Electronics rack weight 3100 kg (6840 lb)
Monitor cart 254 kg (560 lb)
Average floor loading – 45 kg (100 lb)
Total system weight/service area 317 kg/sqm (65 lb/sf)
Main cabinet concentrated loads 776 kg (1,710 lb) on 15.2 cm (6 in) diameter pad, 4 pads on 127 cm (50 in) x 107 cm (42 in) centers
Electronics cabinet concentrated loads 63 kg (140 lb) on 3.5 cm (1-3/8 in) diameter pads, 4 pads on 70 cm (27.5 in) x 52 cm (20.5 in) centers
Power specifications
Voltage requirements 200 to 240 VAC three phase; 380 to 415 VAC three phase wye (± 5%) (50 or 60 Hz)
Total harmonic distortion (THD) THD = less than 5%, Single harmonic = less than 3%
Ground to neutral voltage Voltage = less than 1 VRMS
Momentary voltage Interruptions, defined as: voltage drop on one or more phase conductors below 180 VAC for greater than 10 ms
Primary power rating 7.5 KVA (minimum)
Maximum in rush current 58 amps rms
Circuit breaker rating 10,000 amps interrupting capacity (AIC) for voltages up to 240 VAC, 14,000 AIC for voltages greater than 240 VAC
5DX wiring requirements Reference the Agilent 5DX Installation Guide (part number N7200-90116) for hookup wiring confi gurations, full load amperes, circuit breaker size/# poles and conductor size. Note: local electrical wiring codes take precedence
Air requirements 80 psi compressed air
Temperature requirements 16 to 30 ºC, 60 to 86 ºF
Humidity requirements Relative humidity 20% to 60%

This equipment is located in US