HELLER 1809 MKIII Reflow Oven

Listing description

The Heller 1809 MKIII Reflow Oven, manufactured in 2008, is a robust and reliable piece of equipment in the field of electronics manufacturing. It is a successor to the 2006 Heller 1809 EXL Reflow Oven, carrying forward its legacy of excellence. The machine is equipped with 8 zones of top and bottom heating, ensuring uniform temperature distribution for optimal soldering. It also features 2 cooling zones for rapid thermal recovery. The oven supports both edge and mesh conveyance, offering flexibility in handling various types of PCBs. The machine is fully operational, ready to deliver high-quality performance in any production environment.

This equipment is located in US