Toho FLX-2320-S

Listing description

TOHO FLX-2320-S TEMPERATURE MEASUREMENT SOP

Contact for pricing and inspection.
Equipment is currently installed in FAB, and can be viewed upon request.

The FLX-2320-S determines stress by measuring the curvature change of pre- and post-film deposition. The stress calculation is based on Stoney’s equation, which relates the biaxial modulus of the substrate, thickness of the film and the substrate, and the curvature change. The stress measurements can be made from -65°C to 500°C at a heating rate up to 30°C/min. Stress variation with temperature can be used to characterize film properties such as moisture concentration, phase changes, thermal expansion, volume changes, and plastic deformations.
Description:
Thin Film Stress MeasurementSystem. Purchased new in late 2014 for a project that never developed. Like New. Industry standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates up to 200mm in diameter. Incorporating KLA Tencor’s patented Dual Wavelength technology, Toho FLX Series tools determine and analyze surface stress caused by deposited thin films. Comprehensive Data AnalysisIntuitive Windows 7 based analysis software displays any combination of stress, time, surface deflection, or reflected light intensity measurements.• Calculation of biaxial modulus of elasticity, linear expansion coefficient, stress uniformity, and file subtraction.• Trend plotting for Statistical Process Control (SPC).• Calculation of water diffusion coefficient in dielectric films.• Automatic recalculation of stress when film or substrate thickness is corrected.• 2-D and 3-D views of wafer topography.• Plotting of the measured stress-temperature curve. KLA Tencor’s patented dual wavelength technology, which enables the system to select the wavelength most suitable for challenging films such as silicon nitride. Providing fast and accurate measurements and enhanced ease of use at room temperature, the automated rotating stage model offers increased flexibility. The universal stage is recipe programmable for developing 3-D measurements and serves as an optimal monitoring device for verifying film uniformity across the entire 200mm substrate surface. PerformanceScan Range: Programmable up to 200mm.Measurement Range: 1 to 4,000MPa1. Repeatability: 1.3MPa2.Accuracy: Less than 2.5 percent or 1 MPa (whichever is larger).Minimum Radius: 2.0m.Maximum Radius: 33km.Wafer Sizes (mm): 25, 50, 75, 100, 150, 200mm.Minimum Scan Step: 0.02mm.

Includes: (1) TOHO Model #FLX-2320-S

For sale: TOHO Model #FLX-2320-S. Selling "as is, where is." We do not have the ability to test all equipment. This system was de-installed in working, operational condition.

This equipment is located in US