Used Orbotech Symbion S-36

Listing description

Automatic optical inspection system Testable printed circuit boards: Components and solder joint inspection for reflow and wave applications

Component failure detection: component presence or failure, placement precision and polarity, optical character recognition Solder defect detection: under/over solder, tombstone, billboard, coplanarity , raised component leads, shorts, lead-free compliant Inspection method: Orbotech's "Dimensional Picture Infomation eXtraction" (DPIX) Type: 3D Post-Reflow AOI System.
One high-resolution camera for top view, 4 angled side cameras with multi-angle direct lighting
Camera: 4 megapixel camera 2352x1728(top), 4 side cameras
Max PCB size: 550 x 470mm,
2009

This equipment is located in PL