Used TRI TR7007M SII Plus SMT SPI

Listing description

Optical System
Imaging Method Dynamic Imaging
Camera 4M pixel camera
Imaging Resolution 10 um or 15 um (factory setting)
Lighting RGB LED
3D Technology 2-way Fringe Pattern
Field of View
4 Mpix@ 10 um: 20 x 20 mm
4 Mpix@ 15 um: 30 x 30 mm
Inspection Performance
Imaging Speed
4 Mpix@ 10 um: 90 cm2/sec
4 Mpix@ 15 um: 200 cm2/sec
Height Resolution 0.4 um
Max. Solder Height
@ 10 um: 600 um
@ 15 um: 550 um
Motion Table & Control
X-Axis Control Linear Motor and linear scale with DSP-based controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control Ballscrew + AC-servo controller
X-Y Axis Resolution 0.5 um
Z-Axis Resolution 1 um
Board Handling
TR7007M SII Plus: 350 x 350 mm
PCB Thickness 0.5-5 mm
Max PCB Weight 3 kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm
Conveyor Height 880 — 920 mm
* SMEMA Compatible
Inspection Functions
Defects Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging

Measurement
Height
Area
Volume
Offset

Dimensions WxDxH
TR7007M SII Plus: 1000 x 1410 x 1600
Note: not including signal tower, signal tower height 520 mm
Weight
TR7007M SII Plus: 870 kg

This equipment is located in CN