YESTech FX AOI

Listing description

Description

Capture on the fly technology
3D Fusion Lighting (RGB+White LED's)
5 megapixel color imaging
1 top-down and 4 side angle cameras
Quick set-up
High speed, high defect coverage
Low false failure rate
Programmable conveyor for boards up to 20 x 22
Equally effective for paste, pre / post-reflow and final assembly inspection.
Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
Automated Inspection for: • Solder defects • Lead defects • Component presence and position • Correct part / polarity • Through-hole parts • Paste

Specifications

Throughput: Up to 10 sq. in./sec. > 500,000 components per hour
Maximum Board Size: 22” x 20” (560mm x 510mm)
Clearance: 2” (50mm) top and bottom
Minimum Component Size: 0201; 01005 with high magnification option
False Calls: <500 PPM (<0.05% typical)
Defects Detected: Part: position, missing, wrong, polarity, skew, tombstone Lead: bent, lifted, bridging Solder: open, insufficient, short, solder balls

This equipment is located in US