Yestech Ytx-X3 3D X-Ray

Listing description

Description
Nordson YESTECH's versatile X3 Automated X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB's and packaged semiconductors.
Ideal for in-line or off-line operation, the X3's innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information. Programming is fast and intuitive. Nordson YESTECH's state of the art, patented Digital Tomosynthesis Technology acquires multiple images in different slice heights in one inspection cycle. The images can discriminate between components on the top and bottom slices of double sided boards for unimpeded automated inspection.
The utilization of standard package libraries simplify training and ensure program portability across manufacturing lines. Newly available image processing technology integrates several techniques and inspection algorithms, to provide complete inspection coverage with an extremely low false failure rate. When integrated with Nordson YESTECH AOI inspection, these systems can increase fault coverage to include nearly all process defects.
Features :

Automated 2D & 3D inspection
Unsurpassed image quality
High defect detection
Low false calls
Fast throughput
Quick set-up Automated Inspection for:

Opens & shorts
Insufficient / excess solder
Lifted leads & tombstoned parts
BGA R Voids
Component presence and position

Specifications
Inspection Capabilities
Modes: 2D and 3D operation
Throughput: 4 to .5 sq. in./sec
Maximum Board Size: Up to 20B x 18B (508mm x 450mm)
Clearance: Up to 2B (50mm) top and 1B (25mm) bottom
Minimum Component Size: 01005
Defects Detected:
Part: position, missing, wrong, skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
BGA: shorts, voids, position, missing ball
Software
Data Requirements: ASCII Text, NDF pin data
CAD Translation Package: Excel, Aegis, Unicam, NDF translator, YT translator
Programming Skill Level: Technician or operator
Operating System: Windows XP Professional
Off-line Software: Optional - Rework, Review and Program Creation
SPC Software: Optional - Real-time local and remote monitoring of first pass yield, defect trends, and machine utilization.
Hardware
X-Ray Tube:

Maintenance free, sealed reflection target, 5 micron spot size
100 or 130 Kv, 20 to 39-watt max. output

Color Camera: Barcodes and Fids
Facilities
Power: 110 VAC (220 optional) Single Phase 50 / 60 Hz 15amps
Footprint: 59" x 66" x 63" (1,500mm x 1,676mm x 1,600mm)
Weight: 5,500 lbs. (2,495 Kg)
Machine installation: < 1 hour
Compressed Air: 80 psi, 2 CFM

This equipment is located in US