YJ LINK SPI NG/GOOD Buffer AMR Series

Listing description

Designed to stack NG PCB’s and transfer good PCB’s to the next process in FIFO way located next to SPI machine

· PCB shock-free non-contact power transmission

· RS-232C interface with SPI

· NG PCB Anti-Touch verification

· Transfer GOOD PCB to next machine in FIFO way.

· Increased line efficiency in model exchange of

· SCREEN PRINTER

· Adjustable stacking q’ty of NG, GOOD PCB

· ( NG+GOOD=10 )

· SMEMA Interface

· Compact design

· LED Tower light

· Touch screen operation.

This equipment is located in EE