Hesse BJ939 Wire Bonder

Listing description

60° Bondhead; e-box; Belt conveyor;

The Hesse BJ939 Wire Bonder is a fully automatic heavy wire wedge bonder developed for processing a wide range of substrates, chips, and other materials1. It is capable of handling wires from 50 µm up to 600 µm with only one bondhead1, making it unique in the market1.
The BJ939 features a large working area of 350 mm x 560 mm12, allowing for flexible use, such as vacuum-clamping of up to six 5" x 7" standard DCBs2. It also offers a precisely programmable bondforce actuator, adjustable up to 5000 cN for ribbon/Cu13.
The machine provides various cutting methods, including Active Cutting for repeatable, precise, programmable cutting depth, and Air Cut for no impact on surface, suitable for highly sensitive chips13.
A standout feature of the BJ939 is its real-time quality monitoring system, which monitors wire deformation, transducer current, and frequency within programmable control limits1. It also includes a non-destructive pull test for wire and ribbon1.
The BJ939 is designed for high speed, with linear motors contributing to its high UPH4. A change from aluminum to copper can be realized within minutes1, demonstrating its flexibility and efficiency. This machine is ideal for power electronics and automotive device applications5.

This equipment is located in CH