ESEC 2008hS Die Bonder

Listing description

The ESEC 2100 hS Die Bonder is a versatile, high-speed platform for various epoxy die attach applications. It offers real-time process monitoring, efficient learning, and error recovery. Its unique Phi-Y concept combines rotational and linear movements for a short pick & place cycle time. It also features advanced trajectory control and a liquid cooling system for excellent accuracy at high speed. The machine supports tool-less exchange of product-specific parts for quick product changeovers. It also supports hot and cold processes. The machine’s technical specifications include a bonding accuracy of 20 µm @ 3σ (15 µm option), a cycle time of 120 ms with the Liquid Cooling option, and it can handle a wafer size of 4" to 12" (on 8" or 12" wafer frames).

This equipment is located in CH