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8" wafer, Ejector, Partial Heated Stage
The Tresky 3002/3102 Die Bonder is a highly advanced and flexible die bonding platform. It is equipped with Tresky’s unique die ejector system for pick-up from wafer, making it especially suitable for all kinds of Si, GaAs, and InP dies down to 30μm thickness12.
The system incorporates True Vertical Technology™, which guarantees parallelism between chip and substrate at any bond height12. This, along with superior ergonomics and a new PC software, makes the platform easy to operate12.
The Tresky 3002/3102 Die Bonder has a programmable Z-Drive with high accuracy and bonding force control12. The Z-movement is 95mm with 360° tool rotation12. The standard bond force range is 20g - 400g, with other force ranges available12. The placement accuracy is ±10μm, with an optional ±1μm depending on the process12.
The system supports a wide range of applications, including Die Attach, Die Sorting, Flip-Chip, 3D Packaging, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic, RFID, Sensor Assembly, Adhesive Bonding, and Eutectic Bonding12.
The Tresky 3002/3102 Die Bonder is a versatile and sophisticated system, designed for precision and ease of use in various industries
This equipment is located in CH
Manufacturer | Tresky |
Model | 3002/3102 |
Year | - |
Country | Switzerland |
Condition | Good |
Main category | PCB and SMT equipment |
Subcategory | Wire Bonder |
ID | P403120012 |
Client type | Machinery dealer |
On Kitmondo since | 2019 |
Number of listings | 17 |
Country | Switzerland |
Last activity | March 12, 2024 |
Contact | Click here |