ASM AB-559A-06 Wire Bonder

Listing description

ASM AB 559A-06 is a high-performance, microprocessor-controlled wire tie designed for multi-point connecting of large-scale integrated circuit chips. The device offers a range of features and capabilities that make it suitable for a variety of microelectronic chip assembly applications.

The ASM AB 559 A 06 is equipped with a precise pitch and yaw mechanism for accurately positioning and tensioning the tips of suturing tools. It also includes dual-head ultrasonic, thermal compression and wedge welding systems to provide a full range of connection options. The machine also features a 13.6-inch color touchscreen with advanced diagnostic, alphanumeric and graphical tools for improved performance and convenience.

The AB 559A-06 offers a compact design with a fully enclosed, dust-free base that helps keep the environment clean. Its wire size of 0.1-2.0 mm, adjustable connection length and 5,000 connection parameters make it suitable for many types chip assembly work. In addition, the device also features a range of productivity features, including customizable menus and automatic wire guidance for easy installation and operation.

Additional features of the ASM AB 559A-06 include easy-to-use real-time databases, advanced security features, and enhanced system monitoring capabilities. It is also designed with an ergonomic control panel and an easy-to-use touchscreen interface for improved control and operation. ease. The built-in diagnostic system allows users to quickly identify and address any issues. The ASM AB 559A-06 bonder is very reliable and an excellent choice for any type of microelectronic chip assembly. It offers a wide range of features and performance capabilities that make it suitable for a variety of production scenarios. It is a powerful and precise system that can deliver accurate and repeatable results on a production basis, allowing for greater throughput and efficiency.

This equipment is located in NL