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Equipment used K&S AT Premier is the master automatic bonder for ultra-high precision micro-connector mating and advanced chip onboard patching tech…

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8" wafer, Ejector, Partial Heated Stage The Tresky 3002/3102 Die Bonder is a highly advanced and flexible die bonding platform. It is equipped wit…

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ASM AB 559A-06 is a high-performance, microprocessor-controlled wire tie designed for multi-point connecting of large-scale integrated circuit chips.…

Highly productive and always aiming for zero defects: the fully automatic, compact wire bonder SPRINT-T 01 was adapted to the special requirements of…

EFSIKA SINGAPORE Sprint WLB is an international leader in the production of precision bonding systems for the electronics industry. This bonder is re…

Wire Bonder Manufacturer: Hesse Mechatronics 60° Bondhead; e-box; Belt conveyor; Machine is in top running condition.

Used equipment SHINKAWA UTC-3000 is an industrial bonder designed for the assembly of high-end home appliances, automotive parts and other applica…

K&S Maxum Plus is a high-performance adhesive bonding equipment designed for use in a variety of industries and applications. It is the premier solut…

Manufacturer: ASM Model : Eagle Express GOCu Ball Bonder 2016