Dage4000 Bond Tester with WP100 Wire Pull and BS250 Ball Shear

Listing description

Model: Dage4000 with WP100 Wire Pull and BS250 Ball Shear modules
Applications: Designed for wire pull tests and ball shear tests in microelectronics and semiconductor manufacturing.
Capabilities: Offers precise measurement of bond strength, ensuring compliance with industry standards for quality and reliability.
Features: Includes advanced diagnostic software for real-time analysis and reporting, user-friendly interface for ease of operation, and robust construction for long-term reliability.
Technical Data:
The Dage4000 Bond Tester is engineered for high-performance testing, with capabilities that support a wide range of bond testing procedures. The inclusion of WP100 and BS250 modules allows for versatile testing options, from wire pull to ball shear, catering to diverse manufacturing specifications and requirements. This equipment is crucial for ensuring the integrity and longevity of electronic components, providing key insights into material properties and bond durability.

Conclusion:
The Dage4000 Bond Tester, complemented by WP100 Wire Pull and BS250 Ball Shear modules, is a superb choice for professionals in the electronics manufacturing sector seeking a reliable and accurate bond testing solution. Its advanced features and comprehensive testing capabilities make it a valuable asset for enhancing quality control processes and ensuring product reliability.

This equipment is located in KR