EVG 150


Last availability: unknown - check availability

Listing description

EVG 150 AUTOMATED COATER / DEVELOPER PROCESSING SYSTEM consisting of:

- Model: EVG150
- Automated Resist Processing Station
- 3 Spin Modules: Bake, Chill & Vapor Prime
- Send/Receive Cassette Station with Ergo Load Mounts
- Cassette to Cassette Handling
- Currently Configured for 4"/100mm & 6"/150mm Wafers
- Up to 8"/200mm Wafer Capable
- Resist and Solvent Level Sensing System with Software Display for Resist Filling Level

- Station 1: Spin Coating Station
• PTFE Spin Chamber
• Programmable Drive Unit for up to 10,000 RPM
• Programmable Dispense Arm for Centre, Edge, and Area Dispense
• For use with 4 Different Resist Lines
• Drain Tank with Filling Level Sensor underneath Coat Module
• Bowl Wash Cover included
• Spinner Chuck: request at time of order
• 2x Standard Resist Pump Dispense Systems for Dispense Coating
• 1x IDI Model 600 High Viscosity Pump for Spin Coating
• 1x Syringe Dispense System for Spin Coating
• 1x Top Side Edge Bead Removal (EBR) System for Spin Coating
• 1x Backside Rinse (BSR) for Spin Coating

- Station 2: Spray Coating Station
• PTFE Coating Chamber
• Programmable Rotational Speed of Substrate
• Spray Unit consisting of Atomizer and Spray Nozzle for Independent Opeartion
• Integrated Solvent Lines for Spray Unit Wash
• Drain Tank with Filling Level Sensor underneath Coat Module
• Bowl Wash Cover Included
• Spinner Chuck: request at time of order
• 1x Syringe Dispense System for Spray Coating
• 1x Exhaust Flow Controller Box
• 1x Top Side Edge Bead Removal (EBR) System for Spray Coating
• 1x Backside Rinse (BSR) for Spray Coating
• 1x 5 Gallon Bowl Wash Tank
• 2x Liquid Primer Dispense System
• 1x Pressurized Tank for Primer

- Station 3: Developer Module
• PTFE Spin Chamber
• Programmable Drive Unit for up to 4,000 RPM
• 1x Dispense Nozzle for Spray Develop, Puddle Develop, DI Water Stream Line
• 1x Additional Develop Dispense System
• 1x Nitrogen Dry Nozzle
• 1x Backside Rinse
• 1x Bypass DI Water System
• Spinner Chuck: request at time of order

- 2x Bake Modules (up to +150C)
- 2x High Temperature Bake Modules (up to +250C)
- 1x High Temperature Bake Module (up to +350C)
- 1x Bake Module for HMDS Vapor Priming (up to +150C)
- 2x Chill Modules, CDA Cooled
-1x Chemical Cabinet for up to 8 Chemicals
- Microsoft Windows based User Interface
- System PC, Keyboard, Cables
- Operations Manual for EVG150
- Manufactured in 2010
- Sold with 6 Month Warranty!


Last availability: unknown - check availability

Listing information

Manufacturer EVG
Model 150
Year 2010
Country USA USA
Condition Good
Main category PCB and Semiconductor
Subcategory Wire Bonder
ID P90210004

Last availability: unknown - check availability

About the seller

Client type Machinery dealer
On Kitmondo since 2011
Number of listings 70
Country USA USA
Last activity Oct. 21, 2019
Contact Click here

Top listings from "Wire Bonder"

View all