EVG 150

Manufacturer EVG
Model 150
Year 2010
Country USA USA
Condition Good
Main category PCB and Semiconductor
Subcategory Wire Bonder
ID P90210004

EVG 150 AUTOMATED COATER / DEVELOPER PROCESSING SYSTEM consisting of:

- Model: EVG150
- Automated Resist Processing Station
- 3 Spin Modules: Bake, Chill & Vapor Prime
- Send/Receive Cassette Station with Ergo Load Mounts
- Cassette to Cassette Handling
- Currently Configured for 4"/100mm & 6"/150mm Wafers
- Up to 8"/200mm Wafer Capable
- Resist and Solvent Level Sensing System with Software Display for Resist Filling Level

- Station 1: Spin Coating Station
• PTFE Spin Chamber
• Programmable Drive Unit for up to 10,000 RPM
• Programmable Dispense Arm for Centre, Edge, and Area Dispense
• For use with 4 Different Resist Lines
• Drain Tank with Filling Level Sensor underneath Coat Module
• Bowl Wash Cover included
• Spinner Chuck: request at time of order
• 2x Standard Resist Pump Dispense Systems for Dispense Coating
• 1x IDI Model 600 High Viscosity Pump for Spin Coating
• 1x Syringe Dispense System for Spin Coating
• 1x Top Side Edge Bead Removal (EBR) System for Spin Coating
• 1x Backside Rinse (BSR) for Spin Coating

- Station 2: Spray Coating Station
• PTFE Coating Chamber
• Programmable Rotational Speed of Substrate
• Spray Unit consisting of Atomizer and Spray Nozzle for Independent Opeartion
• Integrated Solvent Lines for Spray Unit Wash
• Drain Tank with Filling Level Sensor underneath Coat Module
• Bowl Wash Cover Included
• Spinner Chuck: request at time of order
• 1x Syringe Dispense System for Spray Coating
• 1x Exhaust Flow Controller Box
• 1x Top Side Edge Bead Removal (EBR) System for Spray Coating
• 1x Backside Rinse (BSR) for Spray Coating
• 1x 5 Gallon Bowl Wash Tank
• 2x Liquid Primer Dispense System
• 1x Pressurized Tank for Primer

- Station 3: Developer Module
• PTFE Spin Chamber
• Programmable Drive Unit for up to 4,000 RPM
• 1x Dispense Nozzle for Spray Develop, Puddle Develop, DI Water Stream Line
• 1x Additional Develop Dispense System
• 1x Nitrogen Dry Nozzle
• 1x Backside Rinse
• 1x Bypass DI Water System
• Spinner Chuck: request at time of order

- 2x Bake Modules (up to +150C)
- 2x High Temperature Bake Modules (up to +250C)
- 1x High Temperature Bake Module (up to +350C)
- 1x Bake Module for HMDS Vapor Priming (up to +150C)
- 2x Chill Modules, CDA Cooled
-1x Chemical Cabinet for up to 8 Chemicals
- Microsoft Windows based User Interface
- System PC, Keyboard, Cables
- Operations Manual for EVG150
- Manufactured in 2010
- Sold with 6 Month Warranty!

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