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Equipment used K&S AT Premier is the master automatic bonder for ultra-high precision micro-connector mating and advanced chip onboard patching tech…

2 units available Good condition Price is for one unit Videos available

8" wafer, Ejector, Partial Heated Stage The Tresky 3002/3102 Die Bonder is a highly advanced and flexible die bonding platform. It is equipped wit…

The contact angle meter provides information on the adhesion energy of the solid surface and the surface tension of the drop. It has been widely acce…

The ESEC 2100 hS Die Bonder is a versatile, high-speed platform for various epoxy die attach applications. It offers real-time process monitoring, ef…

The EDB65 is an easy-to-use reliable manual bonder which ensures high placement accuracy for all laboratory applications, prototype, preproduction an…

ASM AB 559A-06 is a high-performance, microprocessor-controlled wire tie designed for multi-point connecting of large-scale integrated circuit chips.…

Highly productive and always aiming for zero defects: the fully automatic, compact wire bonder SPRINT-T 01 was adapted to the special requirements of…

Wire Bonder Manufacturer: Hesse Mechatronics 60° Bondhead; e-box; Belt conveyor; Machine is in top running condition.

Manufacturer: ASM Model : Eagle Express GOCu Ball Bonder 2016