PARMI HS 60 SPI

Listing description

The 2008 PARMI SPI HS 60 is a state-of-the-art Solder Paste Inspection System. It features a high frame rate C-Mos Sensor camera system with a pixel resolution of 18x18µm. The system offers a scan resolution of 20µm, a lateral resolution of 18µm, and a height resolution of up to 0.2µm.

It can handle a maximum paste height of 1000µm and paste sizes ranging from 200 x 200µm to 20x20mm. The minimum paste pitch it can accommodate is 150µm.

The system is equipped with a Smema interface and can handle board sizes from 50 x 50mm to 390 x 260mm. The maximum board weight it can handle is 1kg, and it can accommodate board thicknesses from 0.4-4mm.

The system also includes a conveyor stage that operates from left to right. This machine is a testament to the advancements in solder paste inspection technology.

This equipment is located in AT