Laser Ablation Thin Film Deposition System

Year: 2014

A complex integrated system involving both laser ablation and magnetron spraying is the Nano PLD-1000 system, a fully integrated, pulse-modulated laser deposition instrument capable of depositing multilayer films on substrates up to 2 inches in diameter. The system uses three energy sources: the PhysikCOMPex PRO 110 Coherent Lambda laser, the magnetron scattering source and the Veeco 3 cm ion source. …

Price on request

RO Romania

PreeFlow eco-PEN450 and Vieweg dispenser stations

Year: 2018

Complete dispensing systems for electronics manufacturing and PCB technologies. System consists of a preeFlow ECO-EC200-K dispenser driver unit with an eco-PEN450 dispenser handheld or machine applicable gun, Vieweg pressure vessel of 4 litres capacitance, with a motor driven tank mixer also with its motor driver unit as a speed regulator. Complete and fully usable system for dispensing different viscosus materials …

5,470 £

HU Hungary

Inspection table / Conveyor FAMECS FWS-100L

Year:

: Inspection table / FAMECS conveyor Manufacturer: FAMECS FAMECS Model: FWS-100L Technical condition: as is, on site Condition: visible Length: 1200.0 mm Width: 880.0 mm Height: 900.0 mm Power supply: 230V + compressed air

Price on request

FR France

Famecs FL-100LE unloader

Year: ~ 2000

Famecs unloader Manufacturer : Famecs Model: FL-100LE Power supply: 230V + Compressed air Technical condition: as is, on site Condition : visible Length: 1150.0 mm Width: 900.0 mm Height: 1800.0 mm

Price on request

FR France

Charger FAMECS CHARGER FU-100LE

Year:

FAMECS charger Manufacturer : FAMECS Model: CHARGEUR FU-100LE Year of manufacture: Not specified Technical condition: As is, on site Condition : Visible Dimensions: Length: 1250.0 mm Width: 800.0 mm Height: 1800.0 mm Power supply: 230V Compressed air : Yes

Price on request

FR France

Soptop ST60N Aluminum Wire Bonding Machine

Year:

Soptop ST60N Aluminum Wire Bonding Machine Machine never used, like new condition

4,660 £

SE Sweden

IDE integrated dynamics engineering ROB 300 SERIES Semiconductor machine

Year: 2007

IDE integrated dynamics engineering ROB 300 SERIES Robot with Cyberoptics EX-43Q Laser Year 2007

9,950 £

IE Ireland

Mirae Corporation MX 200L SMT line Hot deal

Year: 2023

DESEN In Line Printer Model DSP-1008 - D.K.R: Flawless solder paste precision. Mirae MX200L Pick-and-Place Machine: 21,000 CPH for rapid placement. C-100LD-2-L Conveyor: Seamless PCB flow. HTS-0802-N Reflow Oven: Six zones for perfect soldering. MU-390A-CT Multi-Magazine Unloader: High-throughput efficiency. Ersa ETS 250 Wave Soldering System: Reliable through-hole soldering. MEK ISO-Spector 330SL AOI System: 3D/2D inspection for top quality. SMEMA-compliant with …

208,000 £

LV Latvia

RED EPIC DRAGON 6K Semiconductor machine

Year: 2019

RED EPIC DRAGON 6K Bundle Parts included: RED Epic Dragon Body + Redmag Drive (420h) RED EF Mount + Cap Redmag 240 GB Redmag 128 GB RED LCD 5,6" Touch RED Side Handle RED Low Light OLPF REDmote RED Adapter Module RED Quickplate Module (Vmount) RED Swat Rail 100mm (Handle) RED Top Handle Top Cheese Plate Baseplate + Dovetail (15/19mm …

6,780 £

DE Germany

Comdel CX1250 Semiconductor machine

Year: 2006

COMDEL CX1250 13.56 MHz RF Generator and Match set Accessories: Comdel MATCH PRO CPM-1000 Water Cooling System The COMDEL CX1250 is a powerful 13.56 MHz RF generator that is designed for use in a wide range of industrial and scientific applications. The set includes the Comdel MATCH PRO CPM-1000, which is a high-performance RF matching system that helps to optimize …

Price on request

IE Ireland

WEST BOND 7374B Wire Bonder

Year:

Introducing the WEST BOND 7374B Wire Bonder: - Manufacturer: WEST BOND - Model: 7374B - Technical Condition: Good - State: Visible - Description: Beam Lead Diode Bonder - Year of Manufacture: Not specified - Approximate Year of Manufacture: No This reliable machine is ideal for wire bonding applications. It is in good technical condition and visibly well-maintained. The WEST BOND …

Price on request

IT Italy

Unitek Miyachi 9-021-02 Wire Bonder

Year:

COMPLETE THERMO BONDING MACHINE: Unipulse Welding Trasformer Unitek Equipment mod 9-021-02 . Light force weld head (Brand: Unitek Miyachi mod 2-162-01-02 ). Phasemaster Unitek Miyachi 1-230-04-03 Pulse Counting Kubler mod R-102

Price on request

IT Italy

MIR MIR 250 & MIR 600 Semiconductor machine

Year: 2021

MIR 250 & MIR 600, AMR/AGV robots for transport For sale is a MIR 250 unit with potential PCB conveyor option on top. 1 unit available. https://www.mobile-industrial-robots.com/solutions/robots/mir250/ For sale are 3 units of MIR 600, vintage 2021. Some are new. https://www.mobile-industrial-robots.com/solutions/robots/mir600/

Price on request

EE Estonia

Leica BMLB Semiconductor machine

Year:

Manufacturer: Leica Model: BMLB Type: Biological Microscope Condition: excellent Trinocular Dual Station Teaching Microscope Transmitted Light Large Stage Leica 10x eye pieces Objectives Leica 100x / 1.25 OIL Leica 40x Leica 10x Leica 5x

3,240 £

IE Ireland

WEST BOND 7200-44-A-45C Wire Bonder

Year:

WEST BOND, model N° 7200-44-A-45C – Epoxy Dispense Die Bonder

Price on request

IT Italy

Zaber Linear Motorised stages Semiconductor machine

Year:

Zaber Linear Motorised stages Qty 6 Motorised Stages 1 x 300mm Linear stage : T-LSR300B 4 x 28mm Linear stage:T-LS28 1 x 150MM Linear stage:T-LSR150

Price on request

IE Ireland

Millipore ACX3200 ACX3201 Semiconductor machine

Year:

Millipore ACX3200 ACX3201 Throttle Valve Controller Set Included in this set: Millipore ACX3200 Millipore MDV018 Throttle Gate Valve The Millipore ACX3200 Throttle Valve Controller Set includes the ACX3200 controller and the MDV018 Throttle Gate Valve. This set is designed for precise control of fluid flow in the laboratory or industrial settings. The ACX3200 controller offers advanced features such as a …

Price on request

IE Ireland

THERMO Bonding Machines Wire Bonder

Year:

THERMO BONDING MACHINES (only spare parts) Wire bonder

Price on request

IT Italy

GBX DIGIDROP Wire Bonder

Year:

The contact angle meter provides information on the adhesion energy of the solid surface and the surface tension of the drop. It has been widely accepted for material surface analysis related to wetting, adhesion and absorption. It is used to detect the presence of films, coatings or contaminants with a surface energy different from that of the underlying substrate. It …

Price on request

IT Italy

DYNAPERT Emhart 200 Wire Bonder

Year:

DYNAPERT Emhart 200 Axial Inserting Machine 220 V 50 Hz

Price on request

IT Italy