Specifications

Wafer size 15.24 cm
-------------------
worked hours
hours under power
state as-is, where-is
At local norms ---------
status
Last availability date 30/10/2025

Description

Delvotec Die Bonder 6 inches Wafer
Chip & Wire dept. in the middle and Die bonder Delvotec for 2 by 2 cassette pick up and max 6 inches wafer.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Client type User – small or medium company
Active since 2017
Offers online 3
Last activity Nov. 29, 2025

Description

Delvotec Die Bonder 6 inches Wafer
Chip & Wire dept. in the middle and Die bonder Delvotec for 2 by 2 cassette pick up and max 6 inches wafer.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Specifications

Wafer size 15.24 cm
-------------------
worked hours
hours under power
state as-is, where-is
At local norms ---------
status
Last availability date 30/10/2025

About this seller

Client type User – small or medium company
Active since 2017
Offers online 3
Last activity Nov. 29, 2025

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Delvotec Die Bonder 6 inches Wafer